Comparison of X-ray Inspection Systems for BGNCCGA Quality Assurance and Crack Detection

The use of x-ray technique now become an additional inspection tool requirement for quality control and unique defect due to manufacturing for implementation of advanced electronic packages such as ball grid array (BGAs) and chip scale packages (CSPs). Recently, four x-ray systems were evaluated for their defect detection capability especially for damagekracks induced during thermal cycling of ceramic column grid array (CCGA)/BGA assemblies. These systems were: 1. A 2D real time x-ray with a micro-focus source and image intensifier as detector. For this case, relative position of detector to x-ray source was constant. 2. A 2D system with x-ray transmission similar to the case 1 first one with the exception of detector had rotational capability to provide oblique views. A fully digital x-ray system that is capable to combine 3D volumetric imaging and conventional 2D x-ray for a complete inspection. A custom made 3D computed tomography (CT) x-ray system. It utilizes a high power micro-focus source (cone and parallel beam) and glass scintillator detector or flat panel digital detector to obtain cross-sectional 2D x-ray images with preprogrammed angle views. The reconstruction algorithm then provides a 3D volumetric display 3.